ABSTRACT
This chapter provides details about applied power semiconductors' technologies, particularly those of silicon IGBT-based power modules and intelligent power modules (IPMs). On the basis of their structural features power module packages can be broadly categorized into two types: case type and transfer-molded type. The chapter examines structural reliability and life endurance aspects of a typical power module. It provides details regarding key constructional design aspects of a power module and factors determining its package structure reliability. The application designers on the other hand should consider many aspects and conditions under which the chosen module device would have to operate while meeting proper reliability and quality targets. The chapter also provides a detailed description of the state-of-the-art dual-in-line intelligent power module (DIPIPM) family. Followed by the introduction of the revolutionary DIPIPM series, application of this unique product family expanded rapidly, starting with the high-volume zone of inverter-controlled home appliances.
