ABSTRACT

Nanoelectronics is changing the way the world communicates, and is transforming our daily lives. Continuing Moore’s law and miniaturization of low-power semiconductor chips with ever-increasing functionality have been relentlessly driving R&D of new devices, materials, and process capabilities to meet performance, power, and cost requirements. This book covers up-to-date advances in research and industry practices in nanometrology, critical for continuing technology scaling and product innovation. It holistically approaches the subject matter and addresses emerging and important topics in semiconductor R&D and manufacturing. It is a complete guide for metrology and diagnostic techniques essential for process technology, electronics packaging, and product development and debugging—a unique approach compared to other books. The authors are from academia, government labs, and industry and have vast experience and expertise in the topics presented. The book is intended for all those involved in IC manufacturing and nanoelectronics and for those studying nanoelectronics process and assembly technologies or working in device testing, characterization, and diagnostic techniques.

part |2 pages

Section 1: Characterization and Metrology for MOS Devices and Interconnects

chapter 11|48 pages

Defect Characterization and Metrology

chapter 12|26 pages

3D Electron Tomography for Nanostructures

part |2 pages

Section 2: Characterization Techniques for Novel Materials and Devices beyond CMOS

part |2 pages

Section 4: Characterization and Metrology for 3D Stacked Die/ Package Interconnections

part |2 pages

Section 5: Circuit Diagnostic and Probing Techniques