Characterization of the Chemistry and Mechanical Properties of Interconnect Materials and Interfaces: Impact on Interconnect Reliability

In this chapter, we review the basics and selected advancements of key experimental techniques used to characterize the surface and interface chemistry, adhesion, fracture, and other mechanical properties of interconnect materials. We will also discuss the development of new methodologies and test structures to study the connections between chemical, mechanical, and reliability properties. Case studies will be provided to illustrate the unique integrated approach of materials characterization for building robust and reliable on-chip interconnects.