ABSTRACT
Designers have to be prepared for the scenario where chips do not work as intended or do not meet performance expectations after they are fabricated. Product yield engineers need to know what has caused their product yield to be below expectation. Reliability engineers need to know what circuits or elements have failed from various stresses and those that are returned by the customers. Debug and diagnosis of chip failures is necessary to find the root cause of these issues, and it is best facilitated if the design has accommodated features for debug and diagnosis.
