ABSTRACT

Construction, materials, processes, failure modes, and mechanisms of advanced 3D packaging technologies, such as 3D die stacking, package on package, and through-mold vias, are described and demonstrate the complexity of 3D interconnections. Failure analysis challenges associated with fault isolation (FI), nondestructive image, and sample preparation for defect and damage detection are discussed and solutions are presented. Rapid introduction of these new 3D package architectures to m eet the growing need of new market segments for electronic products will require accelerated characterization methods for 3D interconnections.