ABSTRACT
This chapter covers a noncomprehensive account of such nonplanar and 3D device characteristics and current status of such devices either being investigated or in early production phase. It reviews the progress thus far in nonplanar and 3D NVM device concepts and array proposals in four subsections. The scaling limitations of all planar nonvolatile memorie (NVM) cells covering NROM and NAND cells and arrays could potentially be overcome by implementing full 3D devices and arrays. The chapter describes some nonplanar trench-based device concepts using local injection and storage yielding compact 2 bit/cell designs especially suitable for future NROM applications. It describes the FinFET SONOS and GAA device concepts again primarily for embedded and stand-alone higher performance future NROM/SOC applications. The chapter reviews the SGT-NVM devices and particularly high-density SGT-NAND device proposals. It reviews selected NROM device and array schemes in the next subsection and subsequently the FG device and array schemes in a later subsection.
