ABSTRACT
This chapter explores the opportunities to improve the security in integrated circuit (IC) fabrication brought by emerging fabrication technologies including double patterning lithography (DPL) and three-dimensional (3D) integration. It investigates how DPL can help thwart the attacks from an untrusted employee in a foundry under the trusted foundry and untrusted employee model. 3D integration not only improves chip performance but also unlocks new opportunities to thwart various security threats. With 3D heterogeneous integration, security primitives that are based on special materials or emerging technologies might be integrated with conventional complementary-metal-oxide-semiconductor-based circuit components to form a high-performance and secure chip. The chapter considers the threats and countermeasures in the context that the foundry uses DPL to fabricate the chip. 3D integration is a technology that vertically integrates multiple layers of devices and metals to create a single high-performance chip. The fabrication of stacked 3D ICs can exploit existing 2D IC fabrication processes.
