ABSTRACT
In this chapter, the authors discuss the basic methods in performing a root-cause physical analysis and present an overview of analytical techniques for analyses. Physical analysis, also known as analytical diagnostics or failure analysis, is a major element of reliability engineering. This type of analysis will answer most of the why, where, when, and how questions about the life of a component. It is quite easy to drift down the wrong path during a failure analysis. Once the key questions are answered, a failure analysis plan can be made with the appropriate tests. Depending upon the type of failure, the analytical tools employed will vary. The C-Mode-Scanning Auger Microanalysisis an analytical device that uses acoustic reflection to reveal voids, cracks, disbonds, and delaminations in the bulk of samples. Energy Dispersive X-Ray Spectroscopy is a bulk technique that qualitatively and quantitatively identifies the elemental composition of materials analyzed in a scanning electron microscope.
