ABSTRACT
Multifunctional electrically conductive composite materials and hybrid structures have been developed with increasing demand for innovative electromagnetic interference (EMI) shielding, especially in high-power electronics. Their multifunctional requirements, for example, are driving lightweight composite processing technology to complex, hybrid configurations that require more advanced EMI shielding approaches in electronic assemblies. Many of the enhanced composite material systems being developed for high-power electronic components are strategically integrated into a single, multifunctional assembly that must also meet electromagnetic compatibility (EMC) requirements. A great effort has been made to identify potential material systems and affordable production processes that can be integrated with the complex primary structures, geometries, and multifunctional assembly joining processes to provide structural integrity and EMI shielding up to 80 dB or higher levels.
