ABSTRACT
In most electronic cooling applications the objective is to increase heat transfer rate for a specific surface temperature or to reduce surface temperature for a given heat dissipation. Equation 7.2 shows that this is possible by either increasing convection and/or radiation heat transfer coefficients or increasing surface area. Fins and heat sinks primarily do the latter, but can also affect the local heat transfer coefficient. They are used to increase the heat transfer rate by increasing the heat transfer area. Figures 7.1b and 7.1c shows two examples of common fin geometries, straight or plate fin, and pin or cylindrical fin.
