ABSTRACT

This chapter introduces a method to fabricate three-dimensional cantilevers using both microfabrication techniques and mechanical stress in multilayered thin films. It presents the cointegration of a mechanical sensing component and the complementary metal–oxide–semiconductor (CMOS) circuit on the silicon chip. Microcantilevers are widely used in atomic force microscopy, mass sensing, contact sensing, and force measurements. Building a totally embedded smart sensing system incurs the challenge of selecting materials and methods that are fully compliant for their direct cointegration. Combining several sensors with their associated CMOS electronics, such a hybrid circuit platform will act as a mechanical transducer for airflow and temperature sensing and as a chemical transducer for water concentration sensing. Condensation due to humidity can be viewed as an added layer with a very high conductivity and permittivity. High-speed responses are mainly limited by humidity diffusion into the sensing area and evaporation.