ABSTRACT

The application of irreversible aggregation models and fractal analysis for the description of the curing kinetics of two haloid-containing epoxy polymers was considered in paper [1]. For this purpose let us describe briefly experimental methods used for the considered in the present Chapter epoxy polymers study. Firstly, the curing kinetics of haloid-containing oligomer, having chemical structure [1] was studied. This oligomer (conditional designation EPS-4) was cured by 4,4’-diaminodiphenylmethane (DDM) at stoichiometric ratio DDM: EPS-4. The system EPS-4/DDM curing kinetics was studied by method of inversed gas chromatography (IGC) [1]. The basic parameter received from processing of the experimental data was the constant of the reaction rate kr determined for an interval of reaction conversion degree Q = 0.1-0.7 of kinetic curve Q-t part, where t is curing reaction duration. Ketones (methyl ethyl ketone, 1,4-dioxane, cyclohexanone) were chosen as the standard substances for the retention time determination and argon as the gascarrier [1]. The system EPS-4/DDM curing was studied at three curing temperatures Tcur: 383, 393 and 403 K [1, 2].