ABSTRACT
After the physical mask layout for a circuit is created using a specific design process, it is evaluated by a set of geometric constraints, or rules, for that process. e main objective of design rule checking (DRC) is to achieve a high overall yield and reliability for the design. To meet this goal of improving die yields, DRC has evolved from simple measurement and Boolean checks to more involved rules that modify existing features, insert new features, and check the entire design for process limitations such as layer density. While design rule checks do not validate the design’s logical functionality, they verify that the structure meets the manufacturing constraints for a given design type and process technology.
