ABSTRACT
Microsensors are basically silicon or polymer devices that convert a mechanical signal into an electronic one using microelectronics technology. In smart structures, the electronic signal obtained from the sensors is amplified, signal conditioned and fed to ASIC chips. Using the intelligence in the electronics, the signal will be processed by the microprocessor and controller and then fed to the actuator. Using this type of integrated or smart sensor, one could achieve many actuation functions locally or remotely at different locations using telemetry device as described in Ref. [1]. In smart structures, for example in aircraft, one is interested in studying the strain, stress, deflection, pressure and shear loads on the wings or rotor blades (in the case of helicopters), acceleration, drag and control of drag to reduce the fuel consumption and associated vibration and noise produced due to the separation of laminar flow to turbulent one, temperature, ice formation and deicing, etc. The measurement of such mechanical signals are also important in the automotive industry, in which the sensors are used in airbags, smart suspensions, the control of the correct air-to-fuel ratio in engines, etc.
