ABSTRACT
In Part II we deal with material removal processes, and additive technologies are the focus of Part III. We review gas and vapor phase dry etching processes, including chemical, physical (purely mechanical), and chemical-physical (mostly chemical with some mechanical assist) in Chapter 3. Chapter 4 consists of two parts: one covers wet chemical etching and the other wet bulk micromachining, the latter being chemical etching as well but optimized for the manufacture of ICs, nano-, and micromachines. Chapter 5 discusses thermal removing techniques where thermal energy, provided by a heat source, melts and/or vaporizes material from the work piece. Examples of thermal techniques covered in this chapter are electric discharge machining (EDM) (including µ-EDM), laser-and electron-beam machining (LBM and EBM), and plasma arc cutting. In Chapter 6, we cover traditional and nontraditional mechanical removing techniques. Traditional mechanical material removing technologies covered are mechanical precision machining and abrasive wheel machining. In nontraditional mechanical machining, we deal with ultrasonic drilling, electrolytic in-process dressing (ELID) grinding, water jet, abrasive water jet, abrasive jet machining, and focused ion-beam milling (FIB). Also in this chapter, we highlight recent developments toward miniaturized mechanical manufacturing equipment, the so-called desktop factories.
