ABSTRACT
Power hybrids offer an advantage of locating drive electronics very close to power transistor gate or base, minimizing parasitic inductance of leads and interconnecting wires. It may also prove critical to lower transient pickup and prevent false triggering, when high level currents are switched at high frequency. Power hybrids have no limitation on type or size of integrated circuits that may be used in them-analog, digital, or smart power. The main consideration should be given during system partitioning phase to circuit requirements, susceptibility to noise transients, availability of IC in die form (some ICs may be built as small hybrids utilizing several die in a package) and target hybrid cost. The majority of ICs are assembled using low power technology. The backside of die may be plain silicon or deposited gold metallization. They are mounted using epoxy and interconnected to circuit conductors with small diameter gold wires. In high volume production gold wires may be replaced by aluminum.
