ABSTRACT
Many of the needs that arise with electronic packaging can be categorized as thermal, mechanical, or life analysis and may be analyzed as described in the previous chapters. In some cases, situations arise that do not neatly fit into traditional thermal or mechanical analysis, and a special approach is required. These situations requiring a special approach include:
• Fire-resistance analysis
• Pressure transducer rupture
• Humidity analysis
• Pressure-drop analysis
In other cases, alternative analytical approaches can be used to simplify the required calculations or provide a method of verification. These approaches include:
• Similarity Considerations
• Energy-Based Methods
Some electronic hardware, particularly that which is designed for mounting on aircraft engines, is required to pass a fire-resistance test. Typically a flame is specified that provides a certain amount of heat into a calibration tube, and the electronic unit is required to withstand exposure to the flame without becoming detached from its mounting, or leaking any fluid (see Figure 6-1).
