ABSTRACT
The removal of particles from surfaces is a critical aspect of cleaning in many mod em manufacturing processes. Failure to remove particles adequately from micro electronic circuits during the fabrication process leads to circuit failure and accom panying low wafer yields. Incomplete removal of radioactive or toxic particles in industrial systems results in unnecessary residual contamination. Inadequate re moval of particles from polished optical components reduces their performance quality. Thus, it is clear that improved removal of particles from surfaces is an im portant goal in many modem cleaning applications, and many studies have been performed to understand and improve particle removal technology [1-17].
