ABSTRACT
CMP is an established semiconductor process step for the integrated production of logic and memory devices on silicon wafers. A typical fab consumes >240 million gallons of water [1] (approx. 1100 gallons/300 mm wafer) for both BEOL and FEOL processes, yet the 2001 ITRS Road Map calls for consumption of only approx. 600 gallons/300 mm wafer in 2005 [2, 3]. Currently the CMP process ac counts for about 5-7% of the total water consumed in a fab. Yet, there is still a
critical need to eliminate particle and metal ion contamination while attempting to reach these reduced water usage levels.
