Effects of megasonics coupled with SC-1 process parameters on particle removal on 300-mm silicon wafers

The use of megasonic energy has been shown to enhance the cleaning perform­ ance when combined with SC-1 chemistry. The mechanisms of cleaning in a megasonic field have been studied extensively in the semiconductor industry but their discussions are beyond the scope of this paper. Rather, this paper focuses on the optimization of SC-1 process and overall particle removal efficiency with the use of megasonics.