ABSTRACT
Virtually every industrial process creates particles. The removal of particles dur ing manufacturing processes is of great importance in many industries, including semiconductors, optics, photonics and micro-electromechanical systems (MEMS). Currently the critical particle size in semiconductor manufacturing is given as 58 nm, and it is predicted to reach as low as 30 nm by 2007 [1]. With the need for removal of smaller particles comes the need for improved cleaning techniques. These techniques must remove particles quickly and efficiently while avoiding substrate damage. Additionally, reducing chemical usage is of serious concern for
workplace safety and environmental conservation. The development of dry, rapid, non-contact and non-damaging particle removal methods is a critical need for many manufacturing processes.
