ABSTRACT
Since there are large numbers of devices densely packed in a number of device layers, it brings a significant burden to the supply voltage in 3D ICs. This chapter discusses an allocation algorithm of (TSV) to simultaneously consider both the and in 3D ICs. It first illustrates the need for a high-performance 3D design driven by dynamic power and thermal integrity, and then discusses how to allocate TSVs to simultaneously deliver power supply and remove heat. More importantly, to cope with the large-scale design complexity, the modern technique is applied to handle not only large numbers of dynamic inputs/working-loads but also large sizes of interconnection networks that distribute the power/heat. Experiments applying the design automation for 3D integration presented by this chapter show promising results to reduce both runtime and resource.
