ABSTRACT
In microelectronics development, flexible electronics have been
around for years. For today’s design engineer, electronic component
flexibility would be a chip that can bend and stretch like human
skin. It can be implanted as a health monitor, used in mobile
communication systems, which could be integrated into clothing,
etc. All these applications demand adaptable packaging. Connection
joints take an important role in packaging. The Sn-Ag-Cu lead-free-
type alloy is the most promising replacement for lead-based ones
and the study of its behavior under different loading situations is
therefore critical [1]. Its conventional mechanical properties and
also fatigue behaviors are subjects frequently studied [2-8]. In this
Figure 4.1 Microstructure of a bulk specimen.
