ABSTRACT
Interface fracture toughness of bulk bimaterials has been evaluated
on the basis of the fracture mechanics concept (described in
Chapter 2), where the conventional experimental methods have
been established at the practical level in laboratories (e.g., Rice,
1988; Hutchinson and Suo, 1992; Evans and Dalgleish, 1992).
But evaluating the interface toughness between submicron-or
nanometer-thick films and between the films and the substrate
presents difficulties because the fabricating and loading of such
small specimens is restrictive. Although many testing techniques
have been proposed (e.g., Evans et al., 1999; Volinsky et al., 2002;
Nied, 2003; Thouless, 1994; Lane, 2003), we do not have a universal
method yet. This section briefly reviews the proposed methods.
Table 5.1 summarizes the advantages and disadvantages of each
from the standpoint of the applicability of fracture mechanics and
the feasibility of sample preparation and handling.