ABSTRACT
Figure 20.1 Basic plating apparatus for copper plating. Unbuffered alkaline baths that contain high concentrations of Au(CN)2 give hard, fine-grained deposits. Buffered baths with citrate or phosphate added also give hard deposits and brighter plated films. Precise formulations of plating baths are proprietary because other agents added to control finish and brightness are kept as trade secrets. But general guidelines for bath parameters that need to be controlled in production are supplied by the bath vendors. These may include pH, cell voltage, specific gravity or Baumé, gold content, temperature, total electrolyte content, conducting salt concentrations, etc.
