ABSTRACT
The demand for significantly enhanced materials to keep copper as potential interconnection and thermal management materials in microelectronics packaging has led to widespread investigations. This chapter discusses many of the research accomplishments in the area of powder metallurgy using ruthenium as reinforcement or additive to improve the hardness, oxidation, thermal conductivity, and specific capacitance of their matrix materials. It also discusses different fabrication methods as well as the characterization techniques. Several authors have reported on the thermal conductivity of Cu-carbon nanotubes composites for thermal management in microelectronics. Several research groups have used conventional method to synthesize ruthenium materials composite. Metals reinforced or alloyed with ruthenium particles have found applications in several consumer electronic products such as cell phones, microprocessors, fast static RAM, supercapacitors, home appliances and structural materials. Hence, it is important to examine the unique properties of metal ruthenium alloys.
