ABSTRACT
This chapter discusses the simple models to consider a few of the basics of Rapid thermal processing (RTP) heating. It covers the motivation behind the use of the key RTP applications and recent innovations in the main process applications. Rapid thermal processing has shown itself to offer many technical advantages in forming these dielectric films, and many papers have covered electrical properties and device applications. The special benefits of forming dielectrics in steam ambients will be discussed in more detail in the section on steam-RTP below. Rapid thermal processing can provide reflow properties equivalent to results from furnace annealing by using 100 C-200 C higher temperatures and much shorter process times. Rapid thermal processing has also shown itself to be useful for the densification of deposited oxides used in shallow-trench isolation structures. Rapid thermal processing approaches also present the advantage of reducing the degree of copper diffusion through diffusion barriers.
