ABSTRACT
This chapter discusses the often referred to as low-dielectric constant or low-k materials. The proceeding discussion highlights aspects of the channel cracking problem and provides a framework for predicting the cracking behavior of low-k organosilicate glasses (OSGs) materials in ambient and DI water. The chapter also discusses the channel cracking to examine the influence of elastic properties of the substrate on channel cracking and by extension, channel cracking behavior of OSG films deposited in multilayer film stacks. It examines the channel cracking to comprehend the impact of elastic properties of the underlayer or buffer layers in a multilayered system on the constraint factor and the film energy release rate. The chapter demonstrates the importance of layout design variables, including metal thickness and spacing that could have a significant impact on channel cracking in materials that are susceptible to this type of mechanical failure.
