ABSTRACT

Several recent studies address the numerous challenges faced in the development of lead-free electronic solders since there are no drop-in substitutes for traditional lead-bearing solders. Melting temperature, processing parameters, solderability, mechanical and thermomechanical fatigue behavior, etc. are among those challenges. Unfortunately, the extensive database on leadbearing solders generated over nearly the past several decades is not directly applicable to leadfree solders. As a result, the databases currently available to benchmark reliability models for lead-free solders are incomplete [1].