ABSTRACT

Assembling Pb-free components is similar to standard Pb-bearing components with one major exception: there will be a transition period as the new technology is introduced. Thus, in addition to the new materials and processes, hybrid manufacture (manufacturing both leaded and nonleaded components on the same card) as well as multiple manufacturing lines to handle both leaded and lead-free production must be considered and managed. As is typically the case when introducing a new technology, the database is insufficient and the manufacturing processes have not been standardized, i.e., very little knowledge exists that a practitioner can utilize to bridge to a real production environment, with perhaps the exception of the automotive industry with its need for increased levels of stability that require a higher processing temperature capability as is the case with lead-free solders whose melting points are about 40jC higher than eutectic Sn-Pb.