ABSTRACT
A high velocity flow of a liquid-gas mixture, through a narrow channel between parallel plates, has been recently found to provide very formidable heat flux and heat density removable capability. This technique is of particular interest for thermal management of densely-packaged electronic components and has prompted the study of FC-72 and nitrogen flowing together in a 0.5 mm channel. The paper will describe the experimental apparatus used and the thermofluid data obtained for a range of inlet mixture conditions. Flow regime maps and a theoretical model for such gas-assisted evaporative cooling will be presented and discussed.
