chapter  11
- Hybrid and Heterogeneous Photonic Integration
ByMartijn J. R. Heck, John E. Bowers
Pages 58

The research on silicon photonics in the silicon-on-insulator (SOI) platform is driven by the motivation to realize large-scale and low-cost photonic integrated circuits (PICs), owing to a mature and highly accurate fabrication infrastructure compatible with complementary metal oxide semiconductor (CMOS) technology [1]. This technology allows for compact and highly integrated PICs operating in the telecommunication windows at wavelengths of approximately 1.3 and 1.55 μm. However, SOI-based technology by itself is rather limited in providing high-quality optical sources, detectors, and modulators.