ABSTRACT
Polymers such as PTFE, polyimide (PI) and benzocyclobutene(BCB) are of great interest for the microelectronics industry because of their desirable characteristics: low dielectric constant, low dissipation factor, high thermal stability, and high chemical resistance. Poly(butylene terephthalate) (PBT) is a good candidate for three-dimensional moulded interconnection devices (3D-MID) where the conventional printed circuit board is replaced by a patterned metal layer directly on the injection moulded plastics.
