ABSTRACT
During their production and use in the ©eld, electronic equipment and assemblies are exposed to the in¬uence of moisture and environmental conditions (air, weather, location of the assembly, storage, and cleaning). Air, humidity, and water lead to an electrical conductive connection of adjacent metal surfaces, which may have di£erent electrical potentials and may thus cause disorder of the electrical insulation by developing additional transconducting paths. Other in¬uences like ¬uctuations of temperature or strain caused by harmful substances, vibration, and mechanical stress lead to changes in the electrical conduction properties and destruction of the conductor and insulation materials.
