ABSTRACT
The packaging of integrated circuits requires a knowledge of ceramics and metals to accommodate the fabrication of modules that are used to construct subsystems and entire systems from extremely small components. The electronic component is the smallest replaceable element in the system. The use of ceramics in electronic packaging has advanced to the very sophisticated levels of science and engineering. Early packaging of single diode and transistor devices consisted of producing hermetic seals and electrical connections with adequate provisions for mounting and power distribution. Originally, ceramic-metal packages were used for interconnections and environmental protection of diodes and transistors. Since the inception of these packages, the number of applications has grown to such an extent that they are now also utilized for intraconnections, substrates, power distribution, cooling, inputs, outputs, and engineering changes. Increasing the strength of the ceramic materials to resist the stresses created within the substrate structures is also a major concern.
