ABSTRACT
Most of the integrated circuits produced today are used in consumer applications where the term “high temperature” does not apply, and where cost is king. In the consumer world, premiums may be paid for superior power/speed performance, but temperature capability does not enter the equation. Honeywell’s history with high-temperature silicon-on-insulator (SOI) technology is a story of adapting a technology to develop a cost-effective and competitive solution for real-world needs. SOI technologies can be categorized as either fully depleted or partially depleted. In order to improve the efficiency, starting with the Deep Trek Program, Honeywell shifted to a “single-process” strategy in an effort to consolidate technology and design toolkit maintenance in a single design platform. Honeywell’s high-temperature wafers are fabricated with a gold metallization applied to the wafer backside.
