ABSTRACT
This chapter presents a brief description of different types of qualification for semiconductor electronics and describes stress test–driven reliability qualification approach. It focuses on the concepts, methodologies, and guidelines for reliability qualification approach for extreme environment electronics The stress tests defined in the qualifications are believed to be capable of stimulating and precipitating the electronic device and packaging failures in an accelerated manner compared to use conditions. With CMOS used in much wider temperature ranges, with new electronic technologies along with new packaging configurations and systems, the failure mechanisms can be very different from those addressed in the current standards. Society of Aerospace Engineers has been working on a guideline document for high temperature electronics as one of the efforts in the area of extreme environment electronics qualification. Extreme environment electronics operate in environments beyond the specifications of the existing reliability qualification standards, specifications, or documents, and in some case, even beyond the specifications of the process and technology qualification.
