ABSTRACT
324The research work describes the synthesis of siliconized epoxy resin using Di-phenyl silanediol and DGEBA. Its structural characterization was made using Fourier transform infrared spectroscopy. Gel permeation chromatography (GPC) ascertained its molecular weight. Siliconized epoxy nanocomposites were fabricated using siliconized epoxy resin with 2.5% and 5 wt. % of amine functionalized polyhedral oligomeric silsesquioxane (POSS) using di-amino diphenyl methane (DDM) as the curing agent. Thermal stability of the neat and nanocomposites was evaluated by dynamic mechanical analysis (DMA) and thermo gravimetric analysis (TGA). Scanning electron microscopy (SEM), transmission electron microscopy (TEM) and X-ray diffraction (XRD) techniques were used to investigate the morphology of the above said systems. Dielectric constant was also determined. The results obtained from the study are discussed in detail. The results reveal that the composites thus, synthesized in our study could be used for high-performance applications like aerospace sector.
