ABSTRACT
Products such as vehicles and computers are essentially sets of systems that have been integrated as part of brand name assembler’s product development activities. In essence, such goods are co-packaged amalgamations of different technologies and modules produced by numerous companies other than the brand owner. Co-packaging of core technologies from different primary sources can add significant administrative costs and increase overheads to pay for the licensed manufacture of integrated goods. This is particularly important in electronics, where manufacture of wafers is carried out using semi-conductor technology from more than one vendor.
