ABSTRACT
This chapter describes the co-design methodology for the InP Mach-Zehnder modulator (MZM) and its driver- integrated circuit (IC) to achieve the low power. For the differential schemes, Silicon devices like Silicon-germanium heterojunction bipolar transistor s are suitable for the generation of the driving voltage required for the MZM. The co-design in the TOSA means the impedance engineering between the MZM and the output impedance of the driver-IC. Briefly speaking, the optics and the driver-IC are designed together in terms of impedance for the low-power transmitter. Two different output configurations at the driver-IC are considered to achieve lower power and good signal integrity: open-collector and back-terminated ICs. With regard to the driver-IC architecture, the open-collector IC can be regarded as a lower-power solution than the back-terminated driver-IC. For a comparison of the electro-optic performances of the back-terminated and open-collector driver-ICs, chip-on-carriers must be fabricated.
