ABSTRACT
In this chapter, we present self-contained algorithms and methodologies that EDA engineers can implement from scratch, or in the form of pre-and postprocessing, or plug-ins to an existing tool-either 2D or 3D IC tool-and reproduce the related results. In addition, we describe how 3D IC designers can use various commercial tools built for 2D ICs to handle 3D IC physical design with power, performance, and area (PPA) optimization, as well as multi-physics simulation and reliability analysis. Our choices for particular tools used in this chapter are not due to the lack of features in other tools (in fact, our decision should not discourage the use of other tools). On the contrary, we hope to inspire the development of new EDA algorithms, software, and methodologies. We conclude each section by discussing related issues and implications that EDA engineers may face during tool development for 3D IC physical design.
