ABSTRACT
The ceramic thick-film process can be defined as the sequential screen printing and firing at elevated temperatures of a conductor, resistor, and/or dielectric onto a suitable substrate. The thickness of each thick-film element depends on material and application but is typically between 8 and 50 microns (|xm). This distinguishes thick film from thin film, in which thickness is generally less than 1 |xm. The thick-film process uses simple processing equipment that requires low capital outlay. Since the manufacturing process is simple, design changes can easily be made. Tooling for a new circuit is relatively inexpensive, so that small production runs can be easily accommodated. Production rates can be high, especially when multi-up designs are manufactured. The process also allows the substrates to be inspected after each step. However, materials can be expensive and the overall process often requires many steps, although this can be partially addressed by cofiring more than one print of material.
