ABSTRACT
To match the earlier editions of Ceramic Materials for Electronics published in 1986 and 1992, we have retained the original title of this chapter, i.e., "Multilayer Ceramic Technology." However, to be more accurate we should have named it "Multilayer Ceramic Technology for Packaging and Modules" because today multilayer ceramic (MLC) technology not only is applied to packaging issues but covers a much wider field, including the fabrication of electronic components such as capacitors, varistors, and piezoelectric actuators.
