ABSTRACT

Three-dimensional (3D) integration of microsystems and subsystems has become essential to the future of semiconductor technology development. 3D integration requires a greater understanding of several interconnected systems stacked over each other. While this vertical growth profoundly increases the system functionality, it also exponentially increases the design complexity.

Design of 3D Integrated Circuits and Systems tackles all aspects of 3D integration, including 3D circuit and system design, new processes and simulation techniques, alternative communication schemes for 3D circuits and systems, application of novel materials for 3D systems, and the thermal challenges to restrict power dissipation and improve performance of 3D systems. Containing contributions from experts in industry as well as academia, this authoritative text:

  • Illustrates different 3D integration approaches, such as die-to-die, die-to-wafer, and wafer-to-wafer
  • Discusses the use of interposer technology and the role of Through-Silicon Vias (TSVs)
  • Presents the latest improvements in three major fields of thermal management for multiprocessor systems-on-chip (MPSoCs)
  • Explores ThruChip Interface (TCI), NAND flash memory stacking, and emerging applications
  • Describes large-scale integration testing and state-of-the-art low-power testing solutions

Complete with experimental results of chip-level 3D integration schemes tested at IBM and case studies on advanced complementary metal–oxide–semiconductor (CMOS) integration for 3D integrated circuits (ICs), Design of 3D Integrated Circuits and Systems is a practical reference that not only covers a wealth of design issues encountered in 3D integration but also demonstrates their impact on the efficiency of 3D systems.

chapter 1|55 pages

3D Integration Technology with TSV and IMC Bonding

Edited ByKatsuyuki Sakuma, Katsuyuki Sakuma

chapter 2|17 pages

Wafer-Level Three-Dimensional ICs for Advanced CMOS Integration

Edited ByRonald J. Gutmann, Jian-Qiang Lu

chapter 3|14 pages

Integration of Graphics Processing Cores with Microprocessors

Edited ByDeepak C. Sekar, Ballapuram Chinnakrishnan

chapter 4|21 pages

Electrothermal Simulation of Three-Dimensional Integrated Circuits

Edited ByShivam Priyadarshi, Jianchen Hu, Michael B. Steer, Paul D. Franzon, W. Rhett Davis

chapter 5|45 pages

Thermal Management for 3D ICs/Systems

Edited ByFrancesco Zanini

chapter 6|18 pages

Emerging Interconnect Technologies for 3D Networks-on-Chip

Edited BySharma Rohit, Kiyoung Choi

chapter 7|27 pages

Inductive Coupling ThruChip Interface for 3D Integration

Edited ByRohit Sharma, Krzysztof Iniewski, Sung Kyu Lim

chapter 8|31 pages

Fabrication and Modeling of Copper and Carbon Nanotube-Based Through-Silicon Via

Edited ByRohit Sharma, Krzysztof Iniewski, Sung Kyu Lim

chapter 9|43 pages

Low-Power Testing for 2D/3D Devices and Systems

Edited ByLin Xijiang, Wen Xiaoqing, Xiang Dong