This book introduces the reader to a number of challenges for the operation of electronic devices in various harsh environmental conditions. While some chapters focus on measuring and understanding the effects of these environments on electronic components, many also propose design solutions, whether in choice of material, innovative structures, or strategies for amelioration and repair. Many applications need electronics designed to operate in harsh environments. Readers will find, in this collection of topics, tools and ideas useful in their own pursuits and of interest to their intellectual curiosity.

With a focus on radiation, operating conditions, sensor systems, package, and system design, the book is divided into three parts. The first part deals with sensing devices designed for operating in the presence of radiation, commercials of the shelf (COTS) products for space computing, and influences of single event upset. The second covers system and package design for harsh operating conditions. The third presents devices for biomedical applications under moisture and temperature loads in the frame of sensor systems and operating conditions.

part |2 pages

Section I Radiation

chapter 1|18 pages

Commercial Off-the-Shelf Components in Space Applications

ByStefano Esposito, Massimo Violante

chapter 3|24 pages

Simulation of Single-Event Effects on Fully Depleted Silicon- on-Insulator (FDSOI) CMOS

ByWalter Calienes Bartra, Andreas Vladimirescu, Ricardo Reis

part |2 pages

Section II Sensors and Operating Conditions

chapter 4|18 pages

Electronic Sensors for the Detection of Ovarian Cancer

ByA. M. Whited, Raj Solanki

chapter 5|24 pages

Sensors and Sensor Systems for Harsh Environment Applications

ByAndrea De Luca, Florin Udrea, Guoli Li, Yun Zeng, Nicolas André, Guillaume Pollissard-Quatremère, Laurent A. Francis, Denis Flandre, Zoltan Racz, Julian W. Gardner, Syed Zeeshan Ali, Octavian Buiu, Bogdan C. Serban, Cornel Cobianu, Tracy Wotherspoon

chapter 6|22 pages

III-Nitride Electronic Devices for Harsh Environments

ByShyh-Chiang Shen

part |2 pages

Section III Packaging and System Design

chapter 7|14 pages

Packaging for Systems in Harsh Environments

ByMarc Christopher Wurz, Sebastian Bengsch

chapter 8|18 pages

Corrosion Resistance of Lead-Free Solders under Environmental Stress

BySuhana Mohd Said, Nor Ilyana Muhd Nordin

chapter 10|28 pages

Role of Diffusional Interfacial Sliding during Temperature Cycling and Electromigration-Induced Motion of Copper Through Silicon Via

ByLutz Meinshausen, Ming Liu, Indranath Dutta, Tae-Kyu Lee, Li Li