ABSTRACT

This book chronicles the proceedings of the 5th and 6th symposia on Metallized Plastics: Fundamental and Applied Aspects, held in May 1996 and September 1997 respectively. This volume contains 29, carefully reviewed, revised and up-dated papers which were presented at both symposia. The book is divided in the following three parts: Metallization Te

part |2 pages

PART 1. METALLIZATION TECHNIQUES ANDPROPERTIES OF METAL DEPOSITS

chapter |22 pages

Electroless metallization of polymers: Simplification of the process by using plasma or UV-laser pretreatment

ByM. Romand, M. Charbonnier, M. Alami, J. Baborowski

chapter |16 pages

Pulsed laser deposition of TiN on PMMA and polyimide: A novel route for polymer metallization

ByR. D. Vispute, J. Narayan, K. Jagannadham

chapter |10 pages

Metallization of polymers using plasma enhanced chemical vapor deposited titanium nitride as interlayer

ByA. Weber, A. Dietz, R. Pockelmann and C.-P. Klages

chapter |14 pages

Substrate heating during sputter coating of polymers

ByT. Kalber, T. Jung

chapter |10 pages

High rate coating of plastic films and plastic sheets with clear oxide layers

ByS. Schiller, H. Morgner, N. Schiller, S. Straach

chapter |12 pages

New generation sputtering and plasma polymerization plant for metallization of plastics

ByH. Griinwald, M. Jung, R. Kukla, R. Adam, S. Kunkel, J. Krempel-Hesse

chapter |10 pages

Electrodeposition of copper on PVC using soluble polyaniline

ByC.C.M. Fornari, Jr., C. Heilmann and C.A. Ferreira

chapter |6 pages

Study of mechanism of direct copper plating onto nonconductors via Pd/Sn activation and sulfur promotion

ByC.H. Yang, Y.Y. Wang, C.C. Wan and C.J. Chen

chapter |6 pages

A dual-reaction mechanism for direct copper plating on nonconductors via Pd activation and sulfur promotion

ByC.H. Yang, Y.Y. Wang, C.C. Wan and C.J. Chen

chapter |6 pages

Economical selective metallization of insulating surfaces

ByJ. Y. Lee, C. Q. Cui

chapter |8 pages

Plastics metallization using a dynamic chemical plating process

ByA. Fares Karam, G. Stremsdoerfer

part |2 pages

PART 2. SPECTROSCOPIC INVESTIGATION OF INTERFACIAL INTERACTIONS

chapter |20 pages

Early stages of copper/polyimide interface formation

ByM. Kiene, T. Strunskus, F. Faupel

chapter |6 pages

The spontaneous reaction of Cu (hfac) (TMVS) vapor with Dupont Teflon AF1600

ByD. Popovici, E. Sacher, M. Meunier, D. Leonard, P. Bertrand

chapter |18 pages

The deposition of copper onto Teflon AF1600: An XPS comparison of vapor deposition and sputtering

ByD. Popovici, J.E. Klemberg-Sapieha, G. Czeremuszkin, A. Alptekin, L. Martinu, M. Meunier and E. Sacher

part |2 pages

PART 3. SURFACE MODIFICATION AND ADHESION ASPECTS

chapter |24 pages

Plasma pretreatment of polymer surfaces - Relevance to adhesion of metals

ByJ.F. Friedrich, W.E.S. Unger, A. Lippitz, /. Koprinarov, G. Kuhn, S. Weidner and L. Vogel

chapter |24 pages

Study of the He-NH3 plasma mixtures and their role in the stability of the plasma treated polypropylene surface

ByJ. Kurdi, F. Arefi-Khonsari, M. Tatoulian, J. Amouroux

chapter |12 pages

Metal adhesion enhancement by pretreatment of poly (butyleneterephthalate) surfaces with excimer laser radiation

ByH. Horn, R. Weichenhain, D.A. Wesner, S. Beil andE. W. Kreutz

chapter |24 pages

Ion beam induced adhesion at metal-polymer interfaces

ByJ.E.E. Baglin

chapter |20 pages

Changes in the adhesion strength between copper thin films and polyimide substrates after heat treatment

ByS. Iwamori, T. Miyashita, S. Fukuda, S. Nozaki, K. Sudoh, N. Fukuda

chapter |14 pages

A quantitative adhesion test for metal coated polymer fibres

ByE. K. Chong, M. G. Stevens