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      Integrated Circuit Fabrication
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      Book

      Integrated Circuit Fabrication

      DOI link for Integrated Circuit Fabrication

      Integrated Circuit Fabrication book

      Integrated Circuit Fabrication

      DOI link for Integrated Circuit Fabrication

      Integrated Circuit Fabrication book

      ByKumar Shubham, Ankaj Gupta
      Edition 1st Edition
      First Published 2021
      eBook Published 29 April 2021
      Pub. Location London
      Imprint CRC Press
      DOI https://doi.org/10.1201/9781003178583
      Pages 352
      eBook ISBN 9781003178583
      Subjects Engineering & Technology
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      Shubham, K., & Gupta, A. (2021). Integrated Circuit Fabrication (1st ed.). CRC Press. https://doi.org/10.1201/9781003178583

      ABSTRACT

      This book covers theoretical and practical aspects of all major steps in the fabrication sequence. This book can be used conveniently in a semester length course on integrated circuit fabrication. This text can also serve as a reference for practicing engineer and scientist in the semiconductor industry. IC Fabrication are ever demanding of technology in rapidly growing industry growth opportunities are numerous. A recent survey shows that integrated circuit currently outnumber humans in UK, USA, India and China. The spectacular advances in the development and application of integrated circuit technology have led to the emergence of microelectronic process engineering as an independent discipline. Integrated circuit fabrication text books typically divide the fabrication sequence into a number of unit processes that are repeated to form the integrated circuit. The effect is to give the book an analysis flavor: a number of loosely related topics each with its own background material.
      Note: T& F does not sell or distribute the Hardback in India, Pakistan, Nepal, Bhutan, Bangladesh and Sri Lanka.

      TABLE OF CONTENTS

      chapter 1|36 pages

      Introduction to Silicon Wafer Processing

      chapter 2|37 pages

      Epitaxy

      chapter 3|27 pages

      Oxidation

      chapter 4|36 pages

      Lithography

      chapter 5|27 pages

      Etching

      chapter 6|39 pages

      Diffusion

      chapter 7|33 pages

      Ion Implantation

      chapter 8|37 pages

      Film Deposition: Dielectric, Polysilicon and Metallization

      chapter 9|16 pages

      Packaging

      chapter 10|30 pages

      VLSI Process Integration

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