Power Hybrid Circuit Design & Manufacture

Packaging is often cited as one of the most performance limiting aspects of advanced power semiconductors. Power hybrids overcome the limitations of conventional packaging and interconnection schemes and extend the operating range of semiconductor devices. At the same time, the use of power hybrids allows the designer to optimize performance by combining discrete devices from

furnace at temperatures near 1000°C. typical furnace profile is shown in Figure Electrical performance of thick-film resistor is strongly influenced by the firing process. When the screened resistor paste pattern passes through the nace, the mixture of glass binder and conductive phase particles undergo sinter- resistor film. The main parameters of the firing profile: temperature rise and descent rates, peak firing temperature and process duration, vary from paste to paste and depend upon the manufacturing technol- resistor film non-homogeneous and particles appear in random distribution. It

There is a considerable overlap in guidelines for design of low power and high power hybrids plexity circuits are partitioned into the low power and high power sections, which lines which are not intended to be all inclusive. They are primarily aimed at spe-

diameter aluminum wire: tool, 2-transducer, 3-wire clamps, 4-aluminum wire, 5-wire

ductor and glass patterns are transferred to a magnetic media, which is used to produce an artwork master in a 1:1 scale on a stable photographic film. The pat- terns for each separate screening operation are individually exposed using pho- toplotting equipment.

Calculations of the thermal resistance and reliability predictions provide theoreti- ditions, which can'

Ref. Ref. Ref. Ref. °F 1