The packaging of electronic devices and systems represents a significant challenge for product designers and managers. Performance, efficiency, cost considerations, dealing with the newer IC packaging technologies, and EMI/RFI issues all come into play. Thermal considerations at both the device and the systems level are also necessary.

The Electronic Packaging Handbook, a new volume in the Electrical Engineering Handbook Series, provides essential factual information on the design, manufacturing, and testing of electronic devices and systems.

Co-published with the IEEE, this is an ideal resource for engineers and technicians involved in any aspect of design, production, testing or packaging of electronic products, regardless of whether they are commercial or industrial in nature. Topics addressed include design automation, new IC packaging technologies, materials, testing, and safety.

Electronics packaging continues to include expanding and evolving topics and technologies, as the demand for smaller, faster, and lighter products continues without signs of abatement. These demands mean that individuals in each of the specialty areas involved in electronics packaging-such as electronic, mechanical, and thermal designers, and manufacturing and test engineers-are all interdependent on each others knowledge. The Electronic Packaging Handbook elucidates these specialty areas and helps individuals broaden their knowledge base in this ever-growing field.

chapter 1|48 pages

Fundamentals of the Design Process

chapter 2|44 pages

Surface Mount Technology

chapter 3|20 pages

Integrated Circuit Packages

chapter 4|28 pages

Direct Chip Attach

chapter 5|30 pages

Circuit Boards

chapter 6|90 pages

EMC and Printed Circuit Board Design

chapter 7|26 pages

Hybrid Assemblies

chapter 8|68 pages


chapter 9|24 pages

Design for Test

chapter 10|28 pages

Adhesive and Its Application

chapter 11|26 pages

Thermal Management

chapter 12|34 pages


chapter 13|12 pages


chapter 14|46 pages


chapter 16|40 pages

Product Safety and Third-Party Certification