Three-dimensional (3D) integration is identified as a possible avenue for continuous performance growth in integrated circuits (IC) as the conventional scaling approach is faced with unprecedented challenges in fundamental and economic limits. Wafer level 3D IC can take several forms, and they usually include a stack of several thinned IC layers th

chapter 3|28 pages

Wafer Bonding Techniques

chapter 4|20 pages

TSV Etching

chapter 5|30 pages

TSV Filling

chapter 9|30 pages

Advanced Direct Bond Technology

chapter 14|22 pages

Thermal-Aware 3D IC Designs

chapter 16|16 pages